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To improve both inspection efficiency and accuracy, in this work, we describe an explainable deep learning-based visual quality inspection system tailored for visual inspection of solder joints in electronics manufacturing environments.
This section explains observation, measurement, and evaluation of typical solder defects such as solder cracks, solder voids, and decreased bond strength due to insufficient solder wettability.
1 paź 2013 · To improve the performance of automatic optical inspection (AOI), a neural network combined with genetic algorithm for the diagnosis of solder joint defects on printed circuit boards (PCBs) assembled in surface mounting technology (SMT) is presented.
In this article, we surveyed methods presented for the optical inspection of solder joints on PCBs. The methods are grouped by problem-solving approach: reference-based, machine learning/computer vision, deep learning, and 3-D reconstruction.
4 sty 2022 · Around 85% of solder joints are normal, but also sent to the specialists for further inspection. In this work, the main problem is to detect true defect solder joints from misclassified dataset and to reduce the manual workload.
What do the different IPC solder joint classes mean? IPC, the Institute for Interconnecting and Packaging Electronic Circuits, is the recognized governing body for the inspection of solder joints in electronic assemblies. IPC separates solder joints into three classes.
