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  1. 11 mar 2024 · Once a pair of wires are soldered, I have 4 steps of visually confirming a joint is good: Solder should wrap all the way around and in between the wire strands. Solder should be applied upto the edge of the insulation, without melting it.

  2. 4 wrz 2023 · 1. Cold Joints. Think of cold joints as “false joints” because they usually look like well-done and effective bonds for the untrained eye. They are caused by insufficient heat during the soldering process, causing the solder to melt partially, creating an inefficient electrical connection and a weak mechanical bond.

  3. A dry solder joint is a soldering defect that occurs when the solder does not properly wet or adhere to the component leads and PCB pads. It results in a weak and unreliable electrical connection. Factors such as insufficient heat, oxidized surfaces, improper soldering, or using low-quality solder cause dry joints.

  4. If the joints are all close to each other, try doing the joints out of order. Solder one joint, then move to a joint further away, then back to a joint near the first, etc. This should allow some of the heat to dissipate, and reduce the chances of overheating the joints.

  5. 18 cze 2021 · The ideal solder joint for through-hole components is a “concave fillet”, which has a smooth and shiny concave surface at an angle of 40 to 70 degrees from the horizontal, which looks just like the shape of a Hershey’s kiss. It can be achieved when the soldering iron is at the right temperature, with the oxide layer cleaned from the PCB contacts.

  6. 24 paź 2022 · Soldering mistakes can occur when putting together a PCB board or any electronic assembly, particularly when hand soldering. Most of these issues occur when the solder joint isn’t quite right upon completion and is therefore defective. These defective joints tend to stand out as they aren’t uniform with the correctly.

  7. Many factors affect solder joint performance in accelerated thermal cycle (ATC) testing. The experiment described in this paper was designed to address three factors which are known to have substantial influence on solder joint fatigue times due to their effects on cyclic shear strain.

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