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6 kwi 2018 · 74LS08 Pin configuration. 74LS08 is a 14 PIN IC. The chip is available in different packages and is chosen depending on requirement. The description for each pin is given below. Features and Specifications. Operating voltage range: +4.75 to +5.25V. Recommended operating voltage: +5V. Maximum supply voltage:7V.
The 74×08 has 14 pins and contains four basic AND gates laid out as shown in the pinout diagram below: Pin overview for the 74×08 IC. 74×08 Circuit Example. Here’s a simple project you can build using one AND gate from the 74×08 IC. The pull-down resistors pull both inputs to the AND gate LOW when the buttons are not pushed.
Dimensioning and tolerancing per ASME Y14.5M. This drawing is subject to change without notice. This package is hermitically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only. Falls within MIL-STD-1835 and GDIP1-T14.
13 sty 2024 · 74LS08 AND Gate IC Pin Configuration. The pin configuration of 74LS08 AND Gate IC is shown below. This IC includes 14 pins and each pin of this AND gate IC with its functionality is discussed below.
15 lis 2023 · This 14-pin configuration allows the 7408 IC to house four independent AND gates, making it a compact and efficient component for performing logical operations in various digital circuits. The dual in-line package (DIP) of the IC is designed for easy insertion into breadboards or soldering onto printed circuit boards (PCBs).
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018).
Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe.
