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21 lip 2021 · To overcome the scaling limit of planar NAND flash arrays, various three-dimensional (3D) architectures of NAND flash memory and their process integration methods have been investigated...
21 lip 2021 · To overcome the scaling limit of planar NAND flash arrays, various three-dimensional (3D) architectures of NAND flash memory and their process integration methods have been investigated in both industry and academia and adopted in commercial mass production.
To overcome the scaling limit of planar NAND flash arrays, various three-dimensional (3D) architectures of NAND flash memory and their process integration methods have been investigated in both industry and academia and adopted in com-mercial mass production.
18 gru 2021 · In this paper, 3D NAND flash technologies are reviewed in terms of their architecture and fabrication methods, and the advantages and disadvantages of the architectures are compared. View Show...
Abstract. Because NAND Flash possesses several advantages such as very high density, low cost, low power consumption, high programming and reading throughput, and compact form factor, it has been widely adopted as a necessary key component of most modern consumer electronics.
3D NAND (BiCS) Technology. Western Digital’s 3D NAND (BiCS) technology is able to break the 2D scaling ceiling by using the vertical dimension to stack more cells per unit area, while at the same time, relaxing the X-Y dimension of the basic cell.
This paper is about 3-D nand Flash memories and the related integration challenges. Charge trap and floating gate 3-D technologies will be discussed with the aid of several bird's-eye views. Advanced layout techniques will thoroughly be analyzed. Finally, future scaling trends will be presented.
