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21 lip 2021 · To overcome the scaling limit of planar NAND flash arrays, various three-dimensional (3D) architectures of NAND flash memory and their process integration methods have been investigated in...
To overcome the scaling limit of planar NAND flash arrays, various three-dimensional (3D) architectures of NAND flash memory and their process integration methods have been investigated in both industry and academia and adopted in com-mercial mass production.
The purpose of this playbook is to provide an overview of 3D NAND flash technology, its advanced Error Correcting Code (ECC) technology, and low-density parity-check (LDPC) code for endurance and reliability improvements. Learn about 3D NAND flash technology to help build a system of superior performance, ultra-
The article carries out a comparison of 3D NAND architectures that are based on a “punch-and-plug” process—with gate-all-around (GAA) cell devices—against architectures that are based on planar cell devices. The differences and similarities between the two classes of architectures are highlighted.
SCOPE OF THE REPORT. This technology-and-market report focuses on the main equipment used for manufacturing Flash NAND memory, namely deposition. (CVD, ALD), dry etching and lithography tools; we also provide an analysis of the hybrid-bonding market for manufacturing of 3D-NAND with XtackingTM like approaches.
In this Chapter we present the basics of 3D NAND Flash memories and the related integration challenges. There are two main variants of Flash technologies used inside 3D arrays, namely, Floating Gate (FG) and Charge Trap (CT), which are both described in this Chapter with the aid of several bird’s-eye views.
21 lip 2021 · This paper reviews the current research of neuromorphic computing using 3D-NAND flash memory, introduces the forward propagation and backward propagation schemes, and proposes several improvements on the device, structure, and architecture of 3D NAND for neuromorphic Computing.
