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To overcome the scaling limit of planar NAND flash arrays, various three-dimensional (3D) architectures of NAND flash memory and their process integration methods have been investigated in both industry and academia and adopted in com-mercial mass production.
21 lip 2021 · To overcome the scaling limit of planar NAND flash arrays, various three-dimensional (3D) architectures of NAND flash memory and their process integration methods have been investigated in...
21 lip 2021 · In this paper, 3D NAND flash technologies are reviewed in terms of their architecture and fabrication methods, and the advantages and disadvantages of the architectures are compared.
The purpose of this playbook is to provide an overview of 3D NAND flash technology, its advanced Error Correcting Code (ECC) technology, and low-density parity-check (LDPC) code for endurance and reliability improvements. Learn about 3D NAND flash technology to help build a system of superior performance, ultra-
24 paź 2017 · Although the current production of 3D NAND is based on GAA cell devices, it is suggested that architectures with planar cell devices could also be viable for mass production.
In this Chapter we present the basics of 3D NAND Flash memories and the related integration challenges. There are two main variants of Flash technologies used inside 3D arrays, namely, Floating Gate (FG) and Charge Trap (CT), which are both described in this Chapter with the aid of several bird’s-eye views.
A 512Gb 3-bit/Cell 7th-Generation 3D NAND Flash Memory with 184MB/s Write Throughput and 2.0Gb/s Interface.
