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New Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips. Hideaki Sasajima, Itaru Watanabe, Makoto Takamoto, Kazuhiko Dakede, Shingo Itoh, Yoshinori Nishitani, Junichi Tabei, and Takeshi Mori. Abstract EMCs (Epoxy molding compounds) have been used extensively as an encapsulation and protection material for ...
This paper reviews the fundamental properties of epoxy molding compounds and explains the roles and characteristics of the following components which represent encapsulation materials; epoxy resins, hardeners, accelerators, flexibilizers, fillers, flame retardants, coupling agents, and release agents. Download to read the full chapter text.
1 lis 2017 · Homogenous pressure distribution within the molding cavity is of particular importance for encapsulation of mechanically sensitive electronic components, e.g., MEMS sensors, bare dies and Flip...
Epoxy molding compounds (EMCs) for semiconductor are used for protecting semiconductor chips from external environment, specifically from external physical forces such as impact and pressure, and external chemical forces such as moisture, heat, and ultraviolet ray, maintaining the electric insulating property, and providing the semiconductor ...
The process of modern molding is used to encapsulate components in a plastic material to protect ICs or passive devices. Transfer molding is perhaps the most widely used molding process in the semiconductor industry, a trend which is related to the technique’s ability to mold small and complex components effectively.
Epoxy molding compounds (EMCs) for semiconductor are used for protect-ing semiconductor chips from external environment, specifically from external physical forces such as impact and pressure, and external chemical forces such as moisture, heat, and ultraviolet ray, maintaining the electric insulating prop-erty, and providing the semiconductor p...
1 paź 2018 · To eliminate mold voiding on a flip chip QFN package, it is critical to understand the mechanism of how the mold material behaves during molding process resulting to voiding. It is also necessary to establish an accurate detection methodology and identify the best combination of factors.
